Scholarship Programme

The YTL Cement Scholarship offers students pursuing studies in local institutes of higher learning the opportunity to explore their potential and shape their future in the field of engineering.

 

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What We Offer

Full Tuition Coverage

Cover tuition fees, depending on universities' fees.

Living Allowance

Subsistence allowance of RM12,000 per annum.

Career Opportunities

Guaranteed annual internship with the Group. Allowance starts at RM1,000 for the first year and increases in subsequent years.

Eligibility Criteria

Malaysian citizen
Obtained minimum 7As in SPM
Minimum CGPA 3.50 in STPM, Matriculation, Foundation, A-Level, Diploma or equivalent
Having a record of active participation in extracurricular activities is an added advantage
Have obtained admission into a local university for a full-time degree course
Those currently pursuing a Bachelor's Degree with a minimum CGPA of 3.50 are welcomed to apply
Willing to work for YTL Cement for a certain duration upon graduation
Should not have received any other form of scholarship

Eligible Courses

1

Bachelor of Mechanical Engineering

2

Bachelor of Electrical/Electronic Engineering

3

Bachelor of Chemical Engineering

4

Bachelor of Civil Engineering

5

Bachelor of Science (Chemistry)

Application Process

Step 1

Complete the YTL Cement Scholarship Application Form

Click here and fill in the YTL Cement Scholarship Application form. Every successful submission will be notified via registered email.

Step 2

Interview & Assessment

Shortlisted candidates will be invited for an interview session where we assess your potential, passion, and commitment to education.

Step 3

Panel Interview

Shortlisted candidates will be required to attend the final stage Panel Interview before being offered the scholarship.

Meet Our Scholars

Meet Our Scholars

Learn more about them and get inspired!

Application Status

Thank you for your interest in the YTL Cement Scholarship Programme. The application will be open from 1 June 2026 until 31 July 2026.